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Expert Witness Code 1662
Professional Summary:

This Ph.D. is a microelectronics senior-level engineer with comprehensive manufacturing and technology development experience spanning more than three decades.  He has a broad background in semiconductor process and manufacturing technology with significant expertise acquired through career history of responsibility for Back-End-of-Line (BEOL) and Far-Back-End-of-Line (FBEOL) unit processing and integration, and for Chip:Package interconnection.  He has in-depth experience and skill in BEOL/FBEOL technology development, including transfer to manufacturing, manufacturing implementation, and in program manufacturing and reliability qualification.  He has extensive intellectual property contributions and subject matter expertise in all areas of FBEOL and Chip:Package interconnection, particularly involving FCPBA packaging and advanced interconnect structures (Pb-free solder bumps, CuPillar,etc), and including 3-D packaging. At IBM, he had engineering responsibility for all aspects of process qualification (long-term ownership for RIE, polyimide, and final via sector processing), project management,real-time problem solving in development and manufacturing, process optimization, process integration, chip-package integration, and for structural aspects of wiring interconnects and CMOS design rules through 12 technology node generations from 1um (1985) to 14nm (2014).  

Expertise:
  • BEOL, FBEOL, CPI and Packaging
  • BEOL process development, integration, manufacturing, reliability (Al and Cu BEOL)
  • Chip: Package Interaction (CPI), integration, qualification, reliability
  • Chip to package interconnects, structure, process, reliability
  • FBEOL process development, integration, manufacturing, reliability
  • “Flip-Chip” Technology and Process
  • Laser Fuse structure and process, development, fabrication, integration, reliability
  • Polyimide material, processing, integration, implementation for microelectronics
Additional Information:
  • Ph.D., Chemical Engineering - Clarkson University
  • M.S., Chemical Engineering - University of Connecticut
  • B.S., Chemistry/Biology Dual Major - University of Connecticut

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